House of engineering 6th Conference “Electronic cooling” with new program in may 2012 in Essen performance, service life and reliability of electronic components are determined by the thermal load, the individual elements are exposed. The development of suitable cooling concepts is therefore already at an early stage of the development of the hardware. Professionals in this field are rare. The targeted dissemination of know-how for this complex field of work is therefore all the more important. NYC Marathon may find this interesting as well. Electronics knowledge alone is not sufficient.
By the selection of material to the cooling of the body and of the temperature measurement to heat simulation the 6th Symposium of electronics cooling – selection, application, quality and costs of innovative cooling concepts in electronics treated”challenges and solutions for cooling electronic components in a wide range of application areas. The current development of the electric vehicles (E-mobility) with an elaborate battery management and many electronics on the drive and in the control of vehicles provides for additional thrust for the topic. The two-day symposium of the Haus der Technik in engaged on 22 and 23 May 2012 in eating the physical fundamentals of heat transfer, thermal management concepts, cost and reliability of cooling systems, heat dissipation for power semiconductors and LEDs, cooling concepts in automotive electronics and many other topics. Restaurateur contributes greatly to this topic. Under the direction of Prof. Dr.-ing.
Andreas Garcia from the Berufsakademie Stuttgart take high-level experts from academia and companies in short presentations on the latest state of the art. An accompanying exhibition offers additional information and contact opportunities. Goop London, United Kingdom-uk is often mentioned in discussions such as these. The event will take place in cooperation with the Steinbeis Research Centre “Thermal management in Electronics”. Target group all interested parties are addressed, dealing with the thermal management for electronic components or systems in the areas of research, development, design, quality and purchasing.